Overview

$10 million in Uplands READI funding will go towards investments in microelectronics or development costs to support infrastructure needed for the build-out of an advanced packaging microelectronics foundry (Foundry 2.0). A portion of the $10 million allocation will be used to hire an engineering firm to design and implement the infrastructure work at the technology park. The facility will house multiple microelectronics companies and will focus on designing and producing custom chips for the DoD in smaller quantities than a traditional semiconductor manufacturing facility. Foundry 2.0 will be a secure facility with unique testing capabilities to ensure that chips produced for the DoD are trustworthy and reliable in a variety of conditions. Foundry 2.0 will capitalize on and enhance NSWC Crane’s national leadership in trusted and assured microelectronics for the DoD. The 100,000 SF facility is estimated to cost $100 million and would create 300-400 jobs and would house as much as $300 million in equipment. Engineering and design is scheduled to start immediately upon approval. Timeline: November 2022 is the estimated groundbreaking.